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On March 21-22, the 2023 China International Semiconductor Packaging and Testing Conference and Packaging and Testing "Best Brand Award" Award Ceremony was held in Shanghai. The strength of the company stood out among 87 participating companies and won the "2022-2023 China Semiconductor Packaging and Testing Best Brand Award".

Huayi Microelectronics is a unique company in China that not only has a rich self-developed MOSFET design product line, but also provides power device packaging OEM business to overseas power device manufacturers. Through continuous R&D investment and technological innovation, the company can provide customers with high-end, high-quality and diverse packaging and testing services in the OSAT business field. At present, the company has advanced third-generation semiconductor packaging technology, ultra-thin chip packaging technology, automotive Advanced power device and IPM module packaging and testing core technology, high-reliability power device experiment and failure analysis technology, etc.; more than 60 types of packaging shapes such as TOLL, TO (220, 220F, 262, 263, 247, DPAK), PDFN, IPM, etc. . With its strength, Huayi Microelectronics fully supports the high-end advancement of various customers at home and abroad, and provides high-quality packaging and testing services for high-end power devices.

The theme of this conference is "Combining Core Strength, Seeing Core Opportunities and Empowering China", and is organized by the Organizing Committee of China International Semiconductor Packaging and Testing Conference, Today Semiconductor Official Media, Shanghai Fengxian Core World Semiconductor Promotion Center, Core Enterprise Check and PCB Innovation Co-sponsored by the Alliance. The conference will gather elites, and more than 300 semiconductor packaging and testing industry leaders will communicate on the same stage, share industry market and first-line production technology information, and understand the future development of the industry.